The target material's function is many, moreover the market development space is big, it has the very good use in many domains. Almost all of the new sputtering devices use powerful magnets to move electrons into spirals to accelerate the argon ionization around the target, resulting in an increase in the probability of collisions between the target and the argon ions,
Increase the sputtering rate. The general metal coating mostly uses the direct current sputtering, but the non-conductive ceramic magnetic material uses the RF Exchange sputtering, the basic principle is uses the glow discharge (glow discharge) in the vacuum to impact the argon (AR) ion to the target material (target) surface, the cation in the plasma will accelerate the surface of the negatively charged electrode, which will cause the material to fly out and deposited on the substrate to form a film.
In general, the use of sputtering process for film coating has several characteristics: (1) metal, alloy or insulation can be made into thin film material. (2) In the appropriate setting conditions, multiple complex targets can be produced by the same composition of the film. (3) A mixture or compound of the target material and the gas molecule can be made by adding oxygen or other active gas to the discharge atmosphere. (4) The input current and sputtering time of the target material can be controlled, and the high precision film thickness is easy to be obtained. (5) More than other processes to facilitate the production of large-scale uniform film. (6) The sputtering particles are not affected by gravity, and the target material and substrate position are free to arrange.