Boron Sputtering Target B Target for Semiconductor

Boron Sputtering Target B Target for Semiconductor

Boron target is of gray metal luster, melting point: 2075℃, density: 2.34g/cm3, purity: 99.9%-99.99%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, precision mechanical processing, etc.. It is mainly used in magnetron sputtering coating for STN, Ai, TFT, TP, LCD,...

Product Details

Boron target is of gray metal luster, melting point: 2075℃, density: 2.34g/cm3, purity: 99.9%-99.99%. It is manufactured through vacuum sintering furnace, hot isostatic pressing, precision mechanical processing, etc.. It is mainly used in magnetron sputtering coating for STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor, diamond, etc..


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