Copper Sputtering Cu Target Copper Target for TP and LCD

Copper Sputtering Cu Target Copper Target for TP and LCD

Copper target is of purple red metallic luster, melting point: 1085℃, boiling point: 2567 ℃, density: 8.96g/cm3, purity: 99.5%-99.999%. Copper target is classified into planar copper target and rotary copper target. Planar copper target is flaky with shape of round, square, etc.. Rotary copper...

Product Details

Copper target is of purple red metallic luster, melting point: 1085℃, boiling point: 2567 ℃, density: 8.96g/cm3, purity: 99.5%-99.999%.


Copper target is classified into planar copper target and rotary copper target. Planar copper target is flaky with shape of round, square, etc.. Rotary copper target is tubular and of high utilization efficiency, but difficult to process. The final product must be through various processing steps such as high pure copper extrusion, stretching, straightening, heat treatment, machining, etc..


It is applicable for DC diode sputtering, sputtering, sputtering, four level triode sputtering, facing target sputtering, ion beam sputtering, magnetron sputtering etc.. It can also be plated with reflective film, conductive film, semiconductor film, capacitor film, decorative film, protective film, integrated circuit, display, etc.. Compared with other targets, the copper target material is cheaper, so copper target is the first choice to meet film’s functional requirements.


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