Rotary silicon target is of gray metallic luster. It has diamond lattice and is hard and brittle. Melting point: 1410 °C, boiling point: 2355 °C, density: 2.33g/cm3, purity: 99.9%-99.999%. It is semiconductor material. Depending on the dopant, it can be N or P type. The silicon wafer is manufactured through plasma spraying or vacuum magnetic levitation smelting and Bonding. Nowadays it is widely used for metal ceramic, aerospace, optical fiber communication, STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor and other magnetron sputtering coating.